3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Wei GuoGeert Van der PlasAndrej IvankovicGeert EnemanVladimir ChermanBart De WachterAbdelkarim MerchaMario GonzalezYann CivaleAugusto RedolfiThibault BuissonA. JourdanBart VandeveldeKenneth J. RebibisIngrid De WolfAntonio La MannaGerald BeyerEric BeyneBart SwinnenPublished in: ICICDT (2012)