Mario Gonzalez

Publication Activity (10 Years)

Years Active: 2006-2022
Publications (10 Years): 13

Top Topics

Web Accessibility

Electro Mechanical

Binary Gravitational Search Algorithm

Top Venues

Microelectron. Reliab.

Publications

Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf
Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. IRPS (2022)
Anastasiia Kruv, Sean R. C. McMitchell, Sergiu Clima, Oguzhan O. Okudur, Nicolo Ronchi, Geert Van den Bosch, Mario Gonzalez, Ingrid De Wolf, Jan Van Houdt
Impact of mechanical strain on wakeup of HfO2 ferroelectric memory. IRPS (2021)
Patricia Acosta-Vargas, Luis Serrano-Costales, Luis Salvador-Ullauri, Isabel L. Nunes, Mario Gonzalez
Toward Accessible Mobile Application Development for Users with Low Vision. AHFE (7) (2020)
Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Gös, Tibor Grasser, Ingrid De Wolf
On the impact of mechanical stress on gate oxide trapping. IRPS (2020)
Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf, A. Furnémont
Impact of Mechanical Stress on the Electrical Performance of 3D NAND. IRPS (2019)
Patricia Acosta-Vargas, Luis Salvador-Ullauri, Jorge Luis Pérez-Medina, Mario Gonzalez, Karina Jimenes, Yves Rybarczyk
Improving Web Accessibility: Evaluation and Analysis of a Telerehabilitation Platform for Hip Arthroplasty Patients. AHFE (8) (2019)
Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectron. Reliab. 87 (2018)
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS (2018)
Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne
Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices. Microelectron. Reliab. (2017)
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tokei
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79 (2017)
Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tokei
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56 (2016)
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tokei
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59 (2016)
Ehsan Monsef, Mario Gonzalez, Won-Jae Yi, Jafar Saniie
Managing Quality of Service in Wireless Body Area Networks using CoAP. EIT (2016)
Michal Jablonski, Riccardo Lucchini, Frederick Bossuyt, Thomas Vervust, Jan Vanfleteren, J. W. C. DeVries, Pasquale Vena, Mario Gonzalez
Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability. Microelectron. Reliab. 55 (1) (2015)
Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Microelectron. Reliab. 55 (5) (2015)
Jan Ackaert, Tony Colpaert, Aditi Malik, Mario Gonzalez
Metallization scheme optimization of plastic-encapsulated electronic power devices. ICICDT (2015)
Mario Gonzalez, Victor M. Cárdenas, Ricardo Alvarez
Nonexistent harmonics generation phenomenon caused by the processing of DQ transformation in power quality applications. ICIT (2015)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans
Design and implementation of flexible and stretchable systems. Microelectron. Reliab. 51 (6) (2011)
Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde, Jan Vanfleteren
Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48 (6) (2008)
Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectron. Reliab. 47 (2-3) (2007)
Mathieu Vanden Bulcke, Kris Baert, Eric Beyne, Mario Gonzalez, Christophe Winters, Tomas Webers
Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier. EMBC (2006)