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Kristof Croes
ORCID
Publication Activity (10 Years)
Years Active: 2008-2023
Publications (10 Years): 26
Top Topics
Aspect Ratio
Top Venues
IRPS
Microelectron. Reliab.
OFC
ISPD
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Publications
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Melina Lofrano
,
Herman Oprins
,
Xinyue Chang
,
Bjorn Vermeersch
,
Olalla Varela Pedreira
,
Alicja Lesniewska
,
Vladimir Cherman
,
Ivan Ciofi
,
Kristof Croes
,
Seongho Park
,
Zsolt Tokei
Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
IRPS
(2023)
Houman Zahedmanesh
,
Philippe Roussel
,
Ivan Ciofi
,
Kristof Croes
A pragmatic network-aware paradigm for system-level electromigration predictions at scale.
IRPS
(2023)
Olalla Varela Pedreira
,
Houman Zahedmanesh
,
Youqi Ding
,
Ivan Ciofi
,
Kristof Croes
Challenges for Interconnect Reliability: From Element to System Level.
ISPD
(2023)
Artemisia Tsiara
,
Alicja Lesniewska
,
Philippe Roussel
,
Srinivasan Ashwyn Srinivasan
,
Mathias Berciano
,
Marko Simicic
,
Marianna Pantouvaki
,
Joris Van Campenhout
,
Kristof Croes
Degradation mechanisms in Germanium Electro-Absorption Modulators.
IRPS
(2022)
Lin Hou
,
Emmanuel Chery
,
Kristof Croes
,
Davide Tierno
,
Soon Aik Chew
,
Yangyin Chen
,
Peter Rakbin
,
Eric Beyne
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism.
IRPS
(2022)
Kristof Croes
,
Veerle Simons
,
Brecht Truijen
,
Philippe Roussel
,
Koen Van Sever
,
Artemisia Tsiara
,
Jacopo Franco
,
Philippe Absil
Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors.
OFC
(2022)
Mahta Mayahinia
,
Mehdi B. Tahoori
,
Manu Perumkunnil
,
Kristof Croes
,
Francky Catthoor
Analyzing the Electromigration Challenges of Computation in Resistive Memories.
ITC
(2022)
Houman Zahedmanesh
,
Ivan Ciofi
,
Odysseas Zografos
,
Kristof Croes
,
Mustafa Badaroglu
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.
IRPS
(2022)
Mahta Mayahinia
,
Mehdi B. Tahoori
,
Manu Perumkunnil Komalan
,
Houman Zahedmanesh
,
Kristof Croes
,
Tommaso Marinelli
,
José Ignacio Gómez Pérez
,
Timon Evenblij
,
Gouri Sankar Kar
,
Francky Catthoor
Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
41 (12) (2022)
Houman Zahedmanesh
,
Olalla Varela Pedreira
,
Zsolt Tokei
,
Kristof Croes
Electromigration limits of copper nano-interconnects.
IRPS
(2021)
Houman Zahedmanesh
,
Ivan Ciofi
,
Odysseas Zografos
,
Mustafa Badaroglu
,
Kristof Croes
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.
SLIP
(2021)
Davide Tierno
,
Kristof Croes
,
Arjun Ajaykumar
,
Siva Ramesh
,
Geert Van den Bosch
,
Maarten Rosmeulen
Reliability of Mo as Word Line Metal in 3D NAND.
IRPS
(2021)
Sarath Mohanachandran Nair
,
Rajendra Bishnoi
,
Mehdi B. Tahoori
,
Houman Zahedmanesh
,
Kristof Croes
,
Kevin Garello
,
Gouri Sankar Kar
,
Francky Catthoor
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects.
IRPS
(2020)
Olalla Varela Pedreira
,
Michele Stucchi
,
Anshul Gupta
,
Victor Vega-Gonzalez
,
Marleen van der Veen
,
Stephane Lariviere
,
Christopher J. Wilson
,
Zsolt Tokei
,
Kristof Croes
Metal reliability mechanisms in Ruthenium interconnects.
IRPS
(2020)
Sarath Mohanachandran Nair
,
Rajendra Bishnoi
,
Mehdi Baradaran Tahoori
,
Houman Zahedmanesh
,
Kristof Croes
,
Kevin Garello
,
Gouri Sankar Kar
,
Francky Catthoor
Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects.
IRPS
(2019)
Sofie Beyne
,
Olalla Varela Pedreira
,
Ingrid De Wolf
,
Zsolt Tokei
,
Kristof Croes
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.
IRPS
(2019)
Yunlong Li
,
Michele Stucchi
,
Stefaan Van Huylenbroeck
,
Geert Van der Plas
,
Gerald Beyer
,
Eric Beyne
,
Kristof Croes
TSV process-induced MOS reliability degradation.
IRPS
(2018)
Joris Van Campenhout
,
Yoojin Ban
,
Peter De Heyn
,
Ashwyn Srinivasan
,
Jeroen De Coster
,
Sebastien Lardenois
,
Brad Snyder
,
Sadhishkumar Balakrishnan
,
Guy Lepage
,
Negin Golshani
,
Sofie Janssen
,
Alicja Lesniewska
,
Kristof Croes
,
Andy Miller
,
Peter Verheyen
,
Marianna Pantouvaki
,
Philippe Absil
Silicon Photonics for 56G NRZ Optical Interconnects.
OFC
(2018)
Kristof Croes
,
Vladimir Cherman
,
Melina Lofrano
,
Houman Zahedmanesh
,
Luka Kljucar
,
Mario Gonzalez
,
Ingrid De Wolf
,
Zsolt Tokei
,
Eric Beyne
Stress mitigation of 3D-stacking/packaging induced stresses.
IRPS
(2018)
Deniz Kocaay
,
Philippe Roussel
,
Kristof Croes
,
Ivan Ciofi
,
Alicja Lesniewska
,
Ingrid De Wolf
Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.
IRPS
(2018)
Sofie Beyne
,
Shibesh Dutta
,
Olalla Varela Pedreira
,
Niels Bosman
,
Christoph Adelmann
,
Ingrid De Wolf
,
Zsolt Tokei
,
Kristof Croes
The first observation of p-type electromigration failure in full ruthenium interconnects.
IRPS
(2018)
Luka Kljucar
,
Mario Gonzalez
,
Kristof Croes
,
Ingrid De Wolf
,
Joke De Messemaeker
,
Gayle Murdoch
,
Philip Nolmans
,
Joeri De Vos
,
Jürgen Bömmels
,
Eric Beyne
,
Zsolt Tokei
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.
Microelectron. Reliab.
79 (2017)
Luka Kljucar
,
Mario Gonzalez
,
Ingrid De Wolf
,
Kristof Croes
,
Jürgen Bömmels
,
Zsolt Tokei
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.
Microelectron. Reliab.
56 (2016)
Houman Zahedmanesh
,
Mario Gonzalez
,
Ivan Ciofi
,
Kristof Croes
,
Jürgen Bömmels
,
Zsolt Tokei
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.
Microelectron. Reliab.
59 (2016)
Kristof Croes
,
Joke De Messemaeker
,
Yunlong Li
,
Wei Guo
,
Olalla Varela Pedreira
,
Vladimir Cherman
,
Michele Stucchi
,
Ingrid De Wolf
,
Eric Beyne
Reliability Challenges Related to TSV Integration and 3-D Stacking.
IEEE Des. Test
33 (3) (2016)
Nabi Nabiollahi
,
Nele Moelans
,
Mario Gonzalez
,
Joke De Messemaeker
,
Christopher J. Wilson
,
Kristof Croes
,
Eric Beyne
,
Ingrid De Wolf
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.
Microelectron. Reliab.
55 (5) (2015)
Yunlong Li
,
Stefaan Van Huylenbroeck
,
Els Van Besien
,
Xiaoping Shi
,
Chen Wu
,
Michele Stucchi
,
Gerald Beyer
,
Eric Beyne
,
Ingrid De Wolf
,
Kristof Croes
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias.
Microelectron. Reliab.
54 (9-10) (2014)
Jin Guo
,
Antonis Papanikolaou
,
Michele Stucchi
,
Kristof Croes
,
Zsolt Tokei
,
Francky Catthoor
A tool flow for predicting system level timing failures due to interconnect reliability degradation.
ACM Great Lakes Symposium on VLSI
(2008)
Kristof Croes
,
G. Cannatá
,
L. Zhao
,
Zsolt Tokei
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle.
Microelectron. Reliab.
48 (8-9) (2008)