Negin Golshani

Publication Activity (10 Years)

Years Active: 2010-2024
Publications (10 Years): 4

Top Topics

Room Temperature

Top Venues

IEICE Trans. Electron.

Publications

Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer. OFC (2024)
Jef Van Asch, Jeroen Missinne, Junwen He, Pengfei Xu, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, Dieter Bode, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout, Geert Van Steenberge
Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics. OFC (2024)
Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout
Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects. OFC (2024)
Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil
Silicon Photonics for 56G NRZ Optical Interconnects. OFC (2018)
Ryoichi Ishihara, Jin Zhang, Miki Trifunovic, Jaber Derakhshandeh, Negin Golshani, Daniel M. R. Tajari Mofrad, Tao Chen, Kees Beenakker, Tatsuya Shimoda
Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. IEICE Trans. Electron. (4) (2014)
Negin Golshani, Vahid Mohammadi, Siva Ramesh, Lis K. Nanver
High-ohmic resistors using nanometer-thin pure-boron chemical-vapour-deposited layers. ESSDERC (2013)
Negin Golshani, Jaber Derakhshandeh, Ryoichi Ishihara, C. I. M. Beenakker, Michael Robertson, Thomas Morrison
Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. 3DIC (2010)