Jaber Derakhshandeh

Publication Activity (10 Years)

Years Active: 2010-2023
Publications (10 Years): 3

Top Topics

Semiconductor Manufacturing

Combining Classifiers

Top Venues

IEICE Trans. Electron.

Publications

Bapi Vinnakota, Jaber Derakhshandeh, Eric Beyne, Erik Jan Marinissen, Sreejit Chakravarty
IP Session on Chiplet: Design, Assembly, and Test. VTS (2023)
Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC (2019)
Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC (2016)
Ryoichi Ishihara, Jin Zhang, Miki Trifunovic, Jaber Derakhshandeh, Negin Golshani, Daniel M. R. Tajari Mofrad, Tao Chen, Kees Beenakker, Tatsuya Shimoda
Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics. IEICE Trans. Electron. (4) (2014)
Negin Golshani, Jaber Derakhshandeh, Ryoichi Ishihara, C. I. M. Beenakker, Michael Robertson, Thomas Morrison
Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon. 3DIC (2010)