Samuel Suhard

Publication Activity (10 Years)

Years Active: 2016-2019
Publications (10 Years): 3

Top Topics

Base Classifiers

Integrated Circuit

Combining Classifiers

Top Venues

Publications

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC (2019)
Fumihiro Inoue, Julien Bertheau, Samuel Suhard, Alain Phommahaxay, Takuya Ohashi, Tetsuro Kinoshita, Yohei Kinoshita, Eric Beyne
Protective Layer for Collective Die to Wafer Hybrid Bonding. 3DIC (2019)
Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller
Die to wafer 3D stacking for below 10um pitch microbumps. 3DIC (2016)