Die to wafer 3D stacking for below 10um pitch microbumps.
Jaber DerakhshandehLin HouInge De PreterCarine GeretsSamuel SuhardVikas DubeyGeraldine JamiesonFumihiro InoueTomas WebersPieter BexGiovanni CapuzEric BeyneJohn SlabbekoornTeng WangAnne JourdainGerald BeyerKenneth June RebibisAndy MillerPublished in: 3DIC (2016)