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Giovanni Capuz
Publication Activity (10 Years)
Years Active: 2016-2019
Publications (10 Years): 2
Top Topics
Multiple Layers
Semiconductor Manufacturing
Feed Forward Neural Networks
Combining Classifiers
Top Venues
3DIC
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Publications
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Dimitrios Velenis
,
Joeri De Vos
,
Soon-Wook Kim
,
Jaber Derakhshandeh
,
Pieter Bex
,
Giovanni Capuz
,
Samuel Suhard
,
Kenneth June Rebibis
,
Stefaan Van Huylenbroeck
,
Erik Jan Marinissen
,
Alain Phommahaxay
,
Andy Miller
,
Gerald Beyer
,
Geert Van der Plas
,
Eric Beyne
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
3DIC
(2019)
Jaber Derakhshandeh
,
Lin Hou
,
Inge De Preter
,
Carine Gerets
,
Samuel Suhard
,
Vikas Dubey
,
Geraldine Jamieson
,
Fumihiro Inoue
,
Tomas Webers
,
Pieter Bex
,
Giovanni Capuz
,
Eric Beyne
,
John Slabbekoorn
,
Teng Wang
,
Anne Jourdain
,
Gerald Beyer
,
Kenneth June Rebibis
,
Andy Miller
Die to wafer 3D stacking for below 10um pitch microbumps.
3DIC
(2016)