Stefaan Van Huylenbroeck

Publication Activity (10 Years)

Years Active: 2009-2019
Publications (10 Years): 3

Top Topics

Multiple Layers

Bp Neural Network Model

Electron Microscopy

Top Venues

Microelectron. Reliab.

Publications

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne
Process Complexity and Cost Considerations of Multi-Layer Die Stacks. 3DIC (2019)
Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes
TSV process-induced MOS reliability degradation. IRPS (2018)
Stefaan Van Huylenbroeck, Yunlong Li, Michele Stucchi, Lieve Bogaerts, Joeri De Vos, Gerald Beyer, Eric Beyne, Mohand Brouri, Praveen Nalla, Sanjay Gopinath, Matthew Thorum, Joe Richardson, Jengyi Yu
Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module. 3DIC (2016)
Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean
Active-lite interposer for 2.5 & 3D integration. VLSIC (2015)
Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS (2015)
Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes
Reliability challenges for barrier/liner system in high aspect ratio through silicon vias. Microelectron. Reliab. 54 (9-10) (2014)
Fumihiro Inoue, Harold Philipsen, Marleen H. van der Veen, Kevin Vandersmissen, Stefaan Van Huylenbroeck, Herbert Struyf, Tetsu Tanaka
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias. 3DIC (2014)
Christoph Kerner, Ivan Ciofi, Thomas Chiarella, Stefaan Van Huylenbroeck
Methodology for extracting the characteristic capacitances of a power MOSFET transistor, using conventional on-wafer testing techniques. ESSDERC (2012)
Stefaan Decoutere, Stefaan Van Huylenbroeck, Bernd Heinemann, Alexander Fox, Pascal Chevalier, Alain Chantre, Thomas F. Meister, Klaus Aufinger, Michael Schröter
Pushing the speed limits of SiGe: C HBTs up to 0.5 Terahertz. CICC (2009)