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Harold Philipsen
ORCID
Publication Activity (10 Years)
Years Active: 2011-2015
Publications (10 Years): 1
Top Topics
Factors That Influence
Bounding Box
Aspect Ratio
Electron Microscopy
Top Venues
3DIC
IRPS
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Publications
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Joke De Messemaeker
,
O. Varela Pedreira
,
A. Moussa
,
Nabi Nabiollahi
,
Kris Vanstreels
,
Stefaan Van Huylenbroeck
,
Harold Philipsen
,
Patrick Verdonck
,
Bart Vandevelde
,
Ingrid De Wolf
,
Eric Beyne
,
Kris Croes
Impact of oxide liner properties on TSV Cu pumping and TSV stress.
IRPS
(2015)
Fumihiro Inoue
,
Harold Philipsen
,
Marleen H. van der Veen
,
Kevin Vandersmissen
,
Stefaan Van Huylenbroeck
,
Herbert Struyf
,
Tetsu Tanaka
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.
3DIC
(2014)
Fumihiro Inoue
,
Harold Philipsen
,
Alex Radisic
,
Silvia Armini
,
Peter Leunissen
,
Hiroshi Miyake
,
Ryohei Arima
,
Tomohiro Shimizu
,
Toshiaki Ito
,
Hirofumi Seki
,
Yuko Shinozaki
,
Tomohiko Yamamoto
,
Shoso Shingubara
Low temperature through-Si via fabrication using electroless deposition.
3DIC
(2011)