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Herbert Struyf
Publication Activity (10 Years)
Years Active: 2014-2014
Publications (10 Years): 0
Top Topics
Ground Truth
Bounding Box
Aspect Ratio
Plasma Etching
Top Venues
3DIC
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Publications
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Fumihiro Inoue
,
Harold Philipsen
,
Marleen H. van der Veen
,
Kevin Vandersmissen
,
Stefaan Van Huylenbroeck
,
Herbert Struyf
,
Tetsu Tanaka
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.
3DIC
(2014)