Tomohiro Shimizu

Publication Activity (10 Years)

Years Active: 2010-2023
Publications (10 Years): 11

Top Topics

Multi View Video Sequences

Omnidirectional Camera

Top Venues

VISIGRAPP (5: VISAPP)

Publications

Ryo Hachiuma, Tomohiro Shimizu, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume
Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings. CoRR (2023)
Tomohiro Shimizu, Ryo Hachiuma, Hiroki Kajita, Yoshifumi Takatsume, Hideo Saito
Hand Motion-Aware Surgical Tool Localization and Classification from an Egocentric Camera. J. Imaging 7 (2) (2021)
Tomohiro Shimizu, Kei Oishi, Ryo Hachiuma, Hiroki Kajita, Yoshifumi Takatsume, Hideo Saito
Surgery Recording without Occlusions by Multi-view Surgical Videos. VISIGRAPP (5: VISAPP) (2020)
Ryo Hachiuma, Tomohiro Shimizu, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume
Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings. MICCAI (3) (2020)
Ayuka Yoshida, Tomohiro Shimizu, Tomoyuki Ohkubo, Kazuyuki Kobayashi, Kajiro Watanabe
Development of a Person Search Components Based on an Omnidirectional Camera and a 3D-LiDAR. SICE (2020)
Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. 3DIC (2019)
Tomohiro Shimizu, Kei Oishi, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume
Automatic Viewpoint Switching for Multi-view Surgical Videos. ISMAR Adjunct (2019)
Shunsuke Hanatani, Takuya Yorioka, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara
Study of MacEtch using Additives for Preparation of TSV. 3DIC (2019)
Tomohiro Shimizu, Ryo Hachiuma, Hideo Saito, Takashi Yoshikawa, Chonho Lee
Prediction of Future Shot Direction using Pose and Position of Tennis Player. MMSports@MM (2019)
Tomohiro Shimizu, Wenyang Li, Peng Chen, Yinlai Jiang, Shunta Togo, Hiroshi Yokoi
Toward Automatic Tuning of Tendon-driven Mechanisms: Vibration based Detection of Tendon Tension. ISR (2018)
Kohei Ohta, Atsushi Hirate, Yuto Miyachi, Tomohiro Shimizu, Shoso Shingubara
All-wet TSV filling with highly adhesive displacement plated Cu seed layer. 3DIC (2015)
S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. 3DIC (2013)
Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara
Low temperature through-Si via fabrication using electroless deposition. 3DIC (2011)
Fumihiro Inoue, Takumi Yokoyama, Hiroshi Miyake, Shukichi Tanaka, Toshifumi Terui, Tomohiro Shimizu, Shoso Shingubara
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers. 3DIC (2010)