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S. Nishizawa
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
Thin Film
Aspect Ratio
Electron Microscopy
X Ray
Top Venues
3DIC
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Publications
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S. Nishizawa
,
Ryohei Arima
,
Tomohiro Shimizu
,
Shoso Shingubara
,
Fumihiro Inoue
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
3DIC
(2013)