Shoso Shingubara

Publication Activity (10 Years)

Years Active: 2010-2019
Publications (10 Years): 1

Top Topics

Multiple Layers

Top Venues

Publications

Shunsuke Hanatani, Takuya Yorioka, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara
Study of MacEtch using Additives for Preparation of TSV. 3DIC (2019)
Kohei Ohta, Atsushi Hirate, Yuto Miyachi, Tomohiro Shimizu, Shoso Shingubara
All-wet TSV filling with highly adhesive displacement plated Cu seed layer. 3DIC (2015)
S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV. 3DIC (2013)
Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara
Low temperature through-Si via fabrication using electroless deposition. 3DIC (2011)
Fumihiro Inoue, Takumi Yokoyama, Hiroshi Miyake, Shukichi Tanaka, Toshifumi Terui, Tomohiro Shimizu, Shoso Shingubara
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers. 3DIC (2010)