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Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.

S. NishizawaRyohei ArimaTomohiro ShimizuShoso ShingubaraFumihiro Inoue
Published in: 3DIC (2013)
Keyphrases
  • electron microscopy
  • aspect ratio
  • x ray
  • thin film
  • bounding box
  • computer vision
  • ground truth
  • shape from shading
  • perspective projection