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Ryohei Arima
Publication Activity (10 Years)
Years Active: 2011-2013
Publications (10 Years): 0
Top Topics
Thin Film
Aspect Ratio
Electron Microscopy
X Ray
Top Venues
3DIC
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Publications
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S. Nishizawa
,
Ryohei Arima
,
Tomohiro Shimizu
,
Shoso Shingubara
,
Fumihiro Inoue
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
3DIC
(2013)
Fumihiro Inoue
,
Harold Philipsen
,
Alex Radisic
,
Silvia Armini
,
Peter Leunissen
,
Hiroshi Miyake
,
Ryohei Arima
,
Tomohiro Shimizu
,
Toshiaki Ito
,
Hirofumi Seki
,
Yuko Shinozaki
,
Tomohiko Yamamoto
,
Shoso Shingubara
Low temperature through-Si via fabrication using electroless deposition.
3DIC
(2011)