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Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application.

Taro MatsudairaShunsuke ShindoTomohiro ShimizuTakeshi ItoShoso ShinguharaSatoru Shimizu
Published in: 3DIC (2019)
Keyphrases
  • metal oxide
  • desirable properties
  • film thickness
  • database
  • real time
  • data sets
  • genetic algorithm
  • case study
  • decision support
  • electron microscopy