Joke De Messemaeker

Publication Activity (10 Years)

Years Active: 2012-2017
Publications (10 Years): 4

Top Topics

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tokei
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79 (2017)
Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33 (3) (2016)
Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling. Microelectron. Reliab. 55 (5) (2015)
Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS (2015)
George Vakanas, Björn Vandecasteele, David Schaubroeck, Joke De Messemaeker, Geert Willems, Mark Ashworth, Geoffrey D. Wilcox, Ingrid De Wolf
Sn whisker evaluations in 3D microbumped structures. Microelectron. Reliab. 54 (9-10) (2014)
Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf
Sn phase in the bump and thin film Cu/Sn structures. Microelectron. Reliab. 52 (9-10) (2012)