Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.
Luka KljucarMario GonzalezKristof CroesIngrid De WolfJoke De MessemaekerGayle MurdochPhilip NolmansJoeri De VosJürgen BömmelsEric BeyneZsolt TokeiPublished in: Microelectron. Reliab. (2017)