Zsolt Tokei

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 20

Top Topics

Advanced Technology

Top Venues

Microelectron. Reliab.

VLSI Technology and Circuits

Publications

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS (2023)
Mahta Mayahinia, Hsiao-Hsuan Liu, Subrat Mishra, Zsolt Tokei, Francky Catthoor, Mehdi B. Tahoori
Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes. DATE (2023)
Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Francky Catthoor, Zsolt Tokei, Chenyun Pan
Technology/Memory Co-Design and Co-Optimization Using E-Tree Interconnect. ACM Great Lakes Symposium on VLSI (2023)
Zhenlin Pei, Mahta Mayahinia, Hsiao-Hsuan Liu, Mehdi B. Tahoori, Shairfe Muhammad Salahuddin, Francky Catthoor, Zsolt Tokei, Chenyun Pan
Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access. ISQED (2023)
Victor Vega-Gonzalez, D. Radisic, Bt Chan, S. Choudhury, S. Wang, A. Mingardi, Q. Toan Le, H. Decoster, Y. Oniki, P. Puttarame, Kevin Vandersmissen, J. P. Soulie, A. Peter, A. Sepulveda, D. Batuk, G. T. Martinez, Olivier Richard, Jürgen Bömmels, S. Biesemans, E. Dentoni Litta, Naoto Horiguchi, S. Park, Zsolt Tokei
Integration of a Stacked Contact MOL for Monolithic CFET. VLSI Technology and Circuits (2023)
Zsolt Tokei
Logic Scaling Options for the Next 10 Years: From FinFet to CFET, from Dual Damascene to Semi Damascene. FPGA (2022)
Gayle Murdoch, M. O'Toole, G. Marti, A. Pokhrel, D. Tsvetanova, S. Decoster, S. Kundu, Y. Oniki, A. Thiam, Q. T. Le, O. Varela Pedreira, Alicja Lesniewska, G. Martinez-Alanis, S. Park, Zsolt Tokei
First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP. VLSI Technology and Circuits (2022)
Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes
Electromigration limits of copper nano-interconnects. IRPS (2021)
Stefan Nikolic, Francky Catthoor, Zsolt Tokei, Paolo Ienne
Global Is the New Local: FPGA Architecture at 5nm and Beyond. FPGA (2021)
Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tokei, Kris Croes
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS (2021)
Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tokei, Kris Croes
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. IRPS (2020)
Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tokei, Kristof Croes
Metal reliability mechanisms in Ruthenium interconnects. IRPS (2020)
Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tokei, Kristof Croes
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS (2019)
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS (2018)
Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tokei, Kris Croes
Insights into metal drift induced failure in MOL and BEOL. IRPS (2018)
Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tokei, Kristof Croes
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS (2018)
Trong Huynh Bao, Julien Ryckaert, Zsolt Tokei, Abdelkarim Mercha, Diederik Verkest, Aaron Voon-Yew Thean, Piet Wambacq
Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond. IEEE Trans. Very Large Scale Integr. Syst. 25 (5) (2017)
Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tokei
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. Microelectron. Reliab. 79 (2017)
Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tokei
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. Microelectron. Reliab. 56 (2016)
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tokei
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59 (2016)
Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tokei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen
Constant voltage electromigration for advanced BEOL copper interconnects. IRPS (2015)
Chenyun Pan, Praveen Raghavan, Francky Catthoor, Zsolt Tokei, Azad Naeemi
Technology/circuit co-optimization and benchmarking for graphene interconnects at Sub-10nm technology node. ISQED (2015)
Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tokei, Jürgen Bömmels, Y. Saad, W. Gao
Intrinsic reliability of local interconnects for N7 and beyond. IRPS (2015)
Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tokei
Impact of process variability on BEOL TDDB lifetime model assessment. IRPS (2015)
Ioannis Karageorgos, Michele Stucchi, Praveen Raghavan, Julien Ryckaert, Zsolt Tokei, Diederik Verkest, Rogier Baert, Sushil Sakhare, Wim Dehaene
Impact of interconnect multiple-patterning variability on SRAMs. DATE (2015)
Praveen Raghavan, Marie Garcia Bardon, Doyoung Jang, P. Schuddinck, Dmitry Yakimets, Julien Ryckaert, Abdelkarim Mercha, Naoto Horiguchi, Nadine Collaert, Anda Mocuta, Dan Mocuta, Zsolt Tokei, Diederik Verkest, Aaron Thean, A. Steegen
Holisitic device exploration for 7nm node. CICC (2015)
Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54 (6-7) (2014)
Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, M. Dusa, Arindam Mallik, Sushil Sakhare, B. Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, P. Leray, T.-T. Liu, Kenichi Miyaguchi, Bertrand Parvais, P. Schuddinck, P. Weemaes, Abdelkarim Mercha, Jürgen Bömmels, N. Horiguchi, G. McIntyre, Aaron Thean, Zsolt Tokei, S. Cheng, Diederik Verkest, A. Steegen
Design Technology co-optimization for N10. CICC (2014)
Trong Huynh Bao, Dmitry Yakimets, Julien Ryckaert, Ivan Ciofi, Rogier Baert, Anabela Veloso, Jürgen Bömmels, Nadine Collaert, Philippe Roussel, S. Demuynck, Praveen Raghavan, Abdelkarim Mercha, Zsolt Tokei, Diederik Verkest, Aaron Thean, Piet Wambacq
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies. ESSDERC (2014)
Baojun Tang, Kris Croes, Y. Barbarin, Y. Q. Wang, Robin Degraeve, Y. Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tokei, Ingrid De Wolf
As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability. Microelectron. Reliab. 54 (9-10) (2014)
Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor
A tool flow for predicting system level timing failures due to interconnect reliability degradation. ACM Great Lakes Symposium on VLSI (2008)
Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tokei
Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle. Microelectron. Reliab. 48 (8-9) (2008)
Antonis Papanikolaou, Miguel Miranda, Hua Wang, Francky Catthoor, M. Satyakiran, Pol Marchal, Ben Kaczer, C. Bruynseraede, Zsolt Tokei
Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design. VLSI-SoC (2006)
Y.-L. Li, Zsolt Tokei, Philippe Roussel, Guido Groeseneken, Karen Maex
Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability. Microelectron. Reliab. 45 (9-11) (2005)
Zsolt Tokei, Y.-L. Li, G. P. Beyer
Reliability challenges for copper low-k dielectrics and copper diffusion barriers. Microelectron. Reliab. 45 (9-11) (2005)