Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.
Bart VandeveldeAndrej IvankovicB. DebeckerMelina LofranoKris VanstreelsWei GuoVladimir ChermanMarcel GonzalezGeert Van der PlasIngrid De WolfEric BeyneZsolt TokeiPublished in: Microelectron. Reliab. (2014)
Keyphrases
- finite element
- finite element method
- finite element analysis
- soft tissue
- human computer interaction
- mesh generation
- finite difference
- high speed
- numerical solution
- gpu accelerated
- finite element model
- integrated circuit
- material properties
- boundary element
- tissue deformation
- software package
- surgical simulation
- shear stress