Melina Lofrano

Publication Activity (10 Years)

Years Active: 2011-2023
Publications (10 Years): 7

Top Topics

Integrated Circuit

Ibm Zenterprise

Relative Humidity

Top Venues

Microelectron. Reliab.

Publications

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS (2023)
Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, D. Abdi, Herman Oprins, D. Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, J. Myers, Francky Catthoor, Julien Ryckaert
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS (2023)
Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS (2023)
O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, E. Chery, Ivan Ciofi, Kris Croes
Assessment of critical Co electromigration parameters. IRPS (2022)
Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tokei, Kris Croes
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS (2021)
Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectron. Reliab. 87 (2018)
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS (2018)
Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54 (6-7) (2014)
Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson
Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. Microelectron. Reliab. 51 (9-11) (2011)