Houman Zahedmanesh

Publication Activity (10 Years)

Years Active: 2009-2024
Publications (10 Years): 14

Top Topics

Application Level

Physical Parameters

Design Considerations

Top Venues

Microelectron. Reliab.

Publications

O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, A. S. Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes
De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. IRPS (2024)
A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes
Impact of via geometry and line extension on via-electromigration in nano-interconnects. IRPS (2023)
Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes
A pragmatic network-aware paradigm for system-level electromigration predictions at scale. IRPS (2023)
Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes
Challenges for Interconnect Reliability: From Element to System Level. ISPD (2023)
Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS (2023)
O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, E. Chery, Ivan Ciofi, Kris Croes
Assessment of critical Co electromigration parameters. IRPS (2022)
Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents. IRPS (2022)
Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil Komalan, Houman Zahedmanesh, Kristof Croes, Tommaso Marinelli, José Ignacio Gómez Pérez, Timon Evenblij, Gouri Sankar Kar, Francky Catthoor
Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (12) (2022)
Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes
Electromigration limits of copper nano-interconnects. IRPS (2021)
Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network. SLIP (2021)
Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor
Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects. IRPS (2020)
Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor
Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects. IRPS (2019)
Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tokei, Eric Beyne
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS (2018)
Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tokei
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. Microelectron. Reliab. 59 (2016)
Houman Zahedmanesh, Caitríona Lally
Determination of the influence of stent strut thickness using the finite element method: implications for vascular injury and in-stent restenosis. Medical Biol. Eng. Comput. 47 (4) (2009)