Hosain Farr

Publication Activity (10 Years)

Years Active: 2018-2023
Publications (10 Years): 2

Top Topics

Physical Parameters

Top Venues

Publications

Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS (2023)
Christine S. Hau-Riege, Huilin Xu, You-Wen Yau, Manasi S. Kakade, Jianfeng Li, Xiaonan Zhang, Hosain Farr
Electromigration of multi-solder ball test structures. IRPS (2018)