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Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.

Youqi DingO. Varela PedreiraMelina LofranoHouman ZahedmaneshT. ChavezHosain FarrIngrid De WolfKris Croes
Published in: IRPS (2023)
Keyphrases
  • physical parameters
  • image sequences
  • image matching
  • physical processes