Sign in

Electromigration limits of copper nano-interconnects.

Houman ZahedmaneshOlalla Varela PedreiraZsolt TokeiKristof Croes
Published in: IRPS (2021)
Keyphrases
  • thin film
  • electron microscopy
  • input output
  • nano scale
  • lower cost
  • fiber optic
  • artificial intelligence
  • multichip module
  • real time
  • databases
  • case study
  • database systems
  • digital images
  • medical images