Olalla Varela Pedreira

Publication Activity (10 Years)

Years Active: 2016-2023
Publications (10 Years): 8

Top Topics

Electron Microscopy

Multichip Module

Reliability Assessment

Top Venues

Publications

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS (2023)
Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes
Challenges for Interconnect Reliability: From Element to System Level. ISPD (2023)
Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes
Electromigration limits of copper nano-interconnects. IRPS (2021)
Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tokei, Kris Croes
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS (2021)
Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tokei, Kristof Croes
Metal reliability mechanisms in Ruthenium interconnects. IRPS (2020)
Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tokei, Kristof Croes
Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch. IRPS (2019)
Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tokei, Kristof Croes
The first observation of p-type electromigration failure in full ruthenium interconnects. IRPS (2018)
Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne
Reliability Challenges Related to TSV Integration and 3-D Stacking. IEEE Des. Test 33 (3) (2016)