Login / Signup
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly.
Melina Lofrano
Vladimir Cherman
Mario Gonzalez
Eric Beyne
Published in:
Microelectron. Reliab. (2018)
Keyphrases
</>
low cost
engineering design
circuit design
real time
high speed
design process
printed circuit boards
design principles
single chip
low power consumption