Moritz Brunion

Publication Activity (10 Years)

Years Active: 2021-2024
Publications (10 Years): 13

Top Topics

Physical Design

Ibm Zenterprise

Hierarchically Organized

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert
Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. IRPS (2024)
Nesara Eranna Bethur, Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim
Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 43 (7) (2024)
Sudipta Das, Samuel Riedel, Marco Bertuletti, Luca Benini, Moritz Brunion, Julien Ryckaert, James Myers, Dwaipayan Biswas, Dragomir Milojevic
3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs. ISCAS (2024)
Nitish Kumar, Sankatali Venkateswarlu, Yukai Chen, Moritz Brunion, Subrat Mishra, Ankur Gupta, Pushpapraj Singh, Francky Catthoor, James Myers, Julien Ryckaert, Dwaipayan Biswas
Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies. IRPS (2024)
Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 3DIC (2023)
Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. IEEE Trans. Very Large Scale Integr. Syst. 31 (12) (2023)
Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, D. Abdi, Herman Oprins, D. Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, J. Myers, Francky Catthoor, Julien Ryckaert
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS (2023)
Sai Pentapati, Anthony Agnesina, Moritz Brunion, Yen-Hsiang Huang, Sung Kyu Lim
On Legalization of Die Bonding Bumps and Pads for 3D ICs. ISPD (2023)
Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. DATE (2022)
Anthony Agnesina, Moritz Brunion, Alberto García Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim
Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs. ISLPED (2022)
Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor
Thermal Performance Analysis of Mempool RISC-V Multicore SoC. IEEE Trans. Very Large Scale Integr. Syst. 30 (11) (2022)
Anthony Agnesina, Moritz Brunion, Jinwoo Kim, Alberto García Ortiz, Dragomir Milojevic, Francky Catthoor, Manu Perumkunnil, Sung Kyu Lim
Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs. ISLPED (2021)
Matheus A. Cavalcante, Anthony Agnesina, Samuel Riedel, Moritz Brunion, Alberto García-Ortiz, Dragomir Milojevic, Francky Catthoor, Sung Kyu Lim, Luca Benini
MemPool-3D: Boosting Performance and Efficiency of Shared-L1 Memory Many-Core Clusters with 3D Integration. CoRR (2021)