Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICs.
Anthony AgnesinaMoritz BrunionAlberto García OrtizFrancky CatthoorDragomir MilojevicManu KomalanMatheus A. CavalcanteSamuel RiedelLuca BeniniSung Kyu LimPublished in: ISLPED (2022)