Giuliano Sisto

Publication Activity (10 Years)

Years Active: 2019-2023
Publications (10 Years): 7

Top Topics

Design Principles

Knowledge Based Systems

Semiconductor Manufacturing

Top Venues

VLSI Technology and Circuits

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Mohamed Naeim, Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser, Giuliano Sisto, Moritz Brunion, Rongmei Chen, Geert Van der Plas, Eric Beyne, Dragomir Milojevic
Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs. 3DIC (2023)
Giuliano Sisto, R. Preston, Rongmei Chen, Gioele Mirabelli, Anita Farokhnejad, Y. Zhou, Ivan Ciofi, Anne Jourdain, A. Veloso, Michele Stucchi, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert
Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node. VLSI Technology and Circuits (2023)
Giuliano Sisto, Odysseas Zografos, Bilal Chehab, Naveen Kakarla, Yang Xiang, Dragomir Milojevic, Pieter Weckx, Geert Hellings, Julien Ryckaert
Evaluation of Nanosheet and Forksheet Width Modulation for Digital IC Design in the Sub-3-nm Era. IEEE Trans. Very Large Scale Integr. Syst. 30 (10) (2022)
Rongmei Chen, Giuliano Sisto, Odysseas Zografos, Dragomir Milojevic, Pieter Weckx, Geert Van der Plas, Eric Beyne
Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. SLIP (2022)
R. Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, A. Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne
Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node. VLSI Technology and Circuits (2022)
Giuliano Sisto, Rongmei Chen, Richard Chou, Geert Van der Plas, Eric Beyne, Rod Metcalfe, Dragomir Milojevic
Design And Sign-off Methodologies For Wafer-To-Wafer Bonded 3D-ICs At Advanced Nodes (invited). SLIP (2021)
Giuliano Sisto, Peter Debacker, Rongmei Chen, Geert Van der Plas, Richard Chou, Eric Beyne, Dragomir Milojevic
Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route. 3DIC (2019)