Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.

Mohamed Naeim Hanqi Yang Pinhong Chen Rong Bao Antoine Dekeyser Giuliano Sisto Moritz Brunion Rongmei Chen Geert Van der Plas Eric Beyne Dragomir Milojevic

Published in: 3DIC (2023)

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