Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVs.
Mohamed NaeimHanqi YangPinhong ChenRong BaoAntoine DekeyserGiuliano SistoMoritz BrunionRongmei ChenGeert Van der PlasEric BeyneDragomir MilojevicPublished in: 3DIC (2023)