Hier-3D: A Methodology for Physical Hierarchy Exploration of 3-D ICs.
Nesara Eranna BethurAnthony AgnesinaMoritz BrunionAlberto García OrtizFrancky CatthoorDragomir MilojevicManu KomalanMatheus A. CavalcanteSamuel RiedelLuca BeniniSung Kyu LimPublished in: IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2024)