Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.

Alicja Lesniewska Philippe J. Roussel Davide Tierno Victor Vega-Gonzalez Marleen H. van der Veen Patrick Verdonck Nicolas Jourdan Christopher J. Wilson Zsolt Tokei Kris Croes

Published in: IRPS (2020)

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