Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
Dimitrios VelenisJoeri De VosSoon-Wook KimJaber DerakhshandehPieter BexGiovanni CapuzSamuel SuhardKenneth June RebibisStefaan Van HuylenbroeckErik Jan MarinissenAlain PhommahaxayAndy MillerGerald BeyerGeert Van der PlasEric BeynePublished in: 3DIC (2019)