Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module.
Stefaan Van HuylenbroeckYunlong LiMichele StucchiLieve BogaertsJoeri De VosGerald BeyerEric BeyneMohand BrouriPraveen NallaSanjay GopinathMatthew ThorumJoe RichardsonJengyi YuPublished in: 3DIC (2016)