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Protective Layer for Collective Die to Wafer Hybrid Bonding.
Fumihiro Inoue
Julien Bertheau
Samuel Suhard
Alain Phommahaxay
Takuya Ohashi
Tetsuro Kinoshita
Yohei Kinoshita
Eric Beyne
Published in:
3DIC (2019)
Keyphrases
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multi layer
integrated circuit
massively parallel
single layer
semiconductor manufacturing
hybrid approaches
data sets
machine learning
artificial intelligence
website
objective function
hidden markov models
collective intelligence
silicon dioxide