Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.
Pengfei XuJunwen HeKoen KennesAnton DvoretskiiArnita PodpodGuy LepageNegin GolshaniRafal MagdziakSwetanshu BipulDieter BodePeter VerheyenMaumita ChakrabartiDimitrios VelenisAndy MillerYoojin BanFilippo FerraroJoris Van CampenhoutPublished in: OFC (2024)