Login / Signup

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.

Bart VandeveldeMario GonzalezParesh LimayePetar RatchevEric Beyne
Published in: Microelectron. Reliab. (2007)
Keyphrases
  • solder ball connect
  • real time
  • visible spectrum
  • database
  • real world
  • computer vision
  • case study
  • information technology
  • multiresolution
  • infrared