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3D stacking using Cu-Cu direct bonding.

Y. H. HuC. S. LiuM. J. LiiKenneth J. RebibisAnne JourdainAntonio La MannaGerald BeyerEric BeyneC. H. Yu
Published in: 3DIC (2011)
Keyphrases
  • electron microscopy
  • mechanical properties
  • image processing
  • data sets
  • computer vision
  • knowledge base
  • multiresolution
  • feature set