Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
Geert Van der PlasParesh LimayeIgor LoiAbdelkarim MerchaHerman OprinsCristina TorregianiSteven ThijsDimitri LintenMichele StucchiGuruprasad KattiDimitrios VelenisVladimir ChermanBart VandeveldeVeerle SimonsIngrid De WolfRiet LabieDan PerryStephane BronckersNikolaos MinasMiro CupacWouter RuythoorenJan Van OlmenAlain PhommahaxayMuriel de Potter de ten BroeckAnn OpdebeeckMichal RakowskiBart De WachterMorin DehanMarc NelisRahul AgarwalAntonio PulliniFederico AngioliniLuca BeniniWim DehaeneYoussef TravalyEric BeynePaul MarchalPublished in: IEEE J. Solid State Circuits (2011)