Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.
Bart VandeveldeFilip VanheeDavy PissoortLieven DegrendeleJohan de BaetsBart AllaertRalph LauwaertFranco ZanonRiet LabieGeert WillemsPublished in: Microelectron. Reliab. (2017)