Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging.
Andrej IvankovicKris VanstreelsDaniel VanderstraetenGuy BrizarRenaud GillonEddy BlansaerBart VandeveldePublished in: Microelectron. Reliab. (2012)
Keyphrases
- experimental data
- machine learning methods
- preprocessing
- benchmark datasets
- qualitative and quantitative
- computational cost
- computationally expensive
- statistical analysis
- machine learning
- neural network
- real time
- probabilistic model
- significant improvement
- machine learning algorithms
- association rules
- search algorithm
- databases