Daniel Vanderstraeten

Publication Activity (10 Years)

Years Active: 2004-2020
Publications (10 Years): 1

Top Topics

Reliability Assessment

High Temperature

Benchmark Datasets

Top Venues

Microelectron. Reliab.

Publications

John M. McGlone, Guy Brizar, Daniel Vanderstraeten, Dorai Iyer, Sallie Hose, Jeff P. Gambino
Effect of Residual TiN on Reliability of Au Wire Bonds during High Temperature Storage. IRPS (2020)
Jan Ackaert, Aditi Malik, Daniel Vanderstraeten
Impact of the leadframe profile on the occurrence of passivation cracks of plastic-encapsulated electronic power devices. ICICDT (2013)
Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. Microelectron. Reliab. 52 (11) (2012)
Sergey Bychikhin, Georg Haberfehlner, J. Rhayem, Daniel Vanderstraeten, Renaud Gillon, Dionyz Pogany
Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation. Microelectron. Reliab. 50 (9-11) (2010)
Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten
Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages. Microelectron. Reliab. 44 (2) (2004)