Package and solder joint reliability analysed by FEM simulation and experiments.
Bart VandeveldeDag AnderssonPublished in: Microelectron. Reliab. (2004)
Keyphrases
- reliability assessment
- finite element method
- finite element model
- mechanical properties
- simulation model
- finite element methods
- data sets
- numerical simulations
- finite element
- neural network
- simulation study
- open source
- software package
- failure rate
- bayesian networks
- highly reliable
- image sequences
- decision trees
- machine learning