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Fine grain thermal modeling and experimental validation of 3D-ICs.

Herman OprinsA. SrinivasanMiroslav CupákVladimir ChermanCristina TorregianiMichele StucchiGeert Van der PlasPaul MarchalBart VandeveldeE. Cheng
Published in: Microelectron. J. (2011)
Keyphrases
  • fine grain
  • coarse grain
  • parallel computation
  • distributed memory
  • computational complexity
  • general purpose
  • parallel algorithm