Artur Wymyslowski

Publication Activity (10 Years)

Years Active: 2007-2017
Publications (10 Years): 2

Top Topics

International Conference

Computational Molecular Biology

Top Venues

Microelectron. Reliab.

Publications

Artur Wymyslowski
Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 74 (2017)
Artur Wymyslowski
Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 62 (2016)
Dawid Jan Król, Artur Wymyslowski, Kamil Nouri Allaf
Adhesion work analysis through molecular modeling and wetting angle measurement. Microelectron. Reliab. 55 (5) (2015)
Artur Wymyslowski
Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 55 (5) (2015)
Ryszard Swierczynski, Krzysztof Urbanski, Artur Wymyslowski
Improving co-design of smart sensor front-ends. MIXDES (2014)
Artur Wymyslowski
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 54 (6-7) (2014)
Didier Chicot, K. Tilkin, K. Jankowski, Artur Wymyslowski
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique. Microelectron. Reliab. 53 (5) (2013)
Artur Wymyslowski
Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Microelectron. Reliab. 53 (8) (2013)
Artur Wymyslowski, Lukasz Dowhan
Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials. Microelectron. Reliab. 53 (3) (2013)
E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectron. Reliab. 52 (7) (2012)
Artur Wymyslowski
2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 52 (7) (2012)
Lukasz Dowhan, Artur Wymyslowski, Pawel Janus, Magdalena Ekwinska, Olaf Wittler
Extraction of elastic-plastic material properties of thin films through nanoindentaion technique with support of numerical methods. Microelectron. Reliab. 51 (6) (2011)
Lukasz Dowhan, Artur Wymyslowski, Stanislaw Kalicinski, Pawel Janus
Numerical prototyping methods in microsystem accelerometers design. Microelectron. Reliab. 51 (7) (2011)
Artur Wymyslowski
2010 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 51 (6) (2011)
Artur Wymyslowski
Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 50 (7) (2010)
Artur Wymyslowski
Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 49 (8) (2009)
Lukasz Dowhan, Artur Wymyslowski, Rainer Dudek
An approach of numerical multi-objective optimization in stacked packaging. Microelectron. Reliab. 48 (6) (2008)
Artur Wymyslowski
Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 48 (6) (2008)
Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectron. Reliab. 47 (12) (2007)
Artur Wymyslowski
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47 (12) (2007)
Artur Wymyslowski, Bart Vandevelde, Dag Andersson
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47 (2-3) (2007)
Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47 (2-3) (2007)
Tomasz Falat, Artur Wymyslowski, Jana Kolbe
Numerical approach to characterization of thermally conductive adhesives. Microelectron. Reliab. 47 (2-3) (2007)