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A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging.
E. R. Weltevreden
S. J. Tesarski
Artur Wymyslowski
Müge Erinc
Alexander W. J. Gielen
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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mechanical properties
multiscale
high density
composite materials
stainless steel
scale space
high speed
finite element model
natural images
image segmentation
edge detection
design process
wavelet transform
data center
wavelet coefficients
image processing
simulated annealing