Müge Erinc

Publication Activity (10 Years)

Years Active: 2004-2012
Publications (10 Years): 0

Top Topics

Mechanical Properties

Simulated Annealing

Top Venues

Microelectron. Reliab.

Publications

E. R. Weltevreden, S. J. Tesarski, Artur Wymyslowski, Müge Erinc, Alexander W. J. Gielen
A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging. Microelectron. Reliab. 52 (7) (2012)
Müge Erinc, Piet J. G. Schreurs, G. Q. Zhang, Marc G. D. Geers
Characterization and fatigue damage simulation in SAC solder joints. Microelectron. Reliab. 44 (9-11) (2004)