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Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique.

Didier ChicotK. TilkinK. JankowskiArtur Wymyslowski
Published in: Microelectron. Reliab. (2013)
Keyphrases
  • reliability analysis
  • high density
  • thin film
  • high speed
  • real world
  • genetic algorithm
  • decision making
  • relational databases
  • fault tree
  • neural network
  • multi objective
  • power plant
  • traffic accidents
  • condition monitoring